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Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
Q1
0.51
A
Q2
–0.34
V SD
Drain–Source Diode Forward
Voltage
Q1
Q2
V GS = 0 V, I S = 0.51 A
V GS = 0 V, I S = –0.34 A
(Note 2)
(Note 2)
0.8
–0.8
1.2
–1.4
V
t rr
Q rr
Diode Reverse Recovery
Time
Diode Reverse Recovery
Charge
Q1
Q2
Q1
Q2
I F = 0.51 A, d iF /d t = 100 A/μs
I F = –0.34 A, d iF /d t = 100 A/μs
I F = 0.51 A, d iF /d t = 100 A/μs
I F = –0.34 A, d iF /d t = 100 A/μs
18
16
16
11
nS
nC
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 130 ° C/W when
mounted on a 0.125
in 2 pad of 2 oz.
copper.
b) 140°C/W when mounted
on a .005 in 2 pad of 2 oz
copper
c) 180°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
NDC7001C Rev B (W)
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